The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Sep. 30, 2016
Intel Corporation, Santa Clara, CA (US);
Juan Eduardo Dominguez, Gilbert, AZ (US);
Hyoung Il Kim, Folsom, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.