Hyoung Il Kim

Title: The Innovative Journey of Hyoung Il Kim

Introduction

Hyoung Il Kim, a prolific inventor based in Folsom, California, has made significant contributions to the field of integrated circuit technology, holding an impressive portfolio of 26 patents. His innovative approach has led to advancements that enhance the design and functionality of semiconductor packages.

Latest Patents

Among Kim's latest patents are groundbreaking designs that showcase his expertise in integrated circuit package design. One notable invention is the "Integrated circuit package with glass spacer," which details an IC package that incorporates a glass spacer situated between two dice. This design improves the overall structural integrity and functionality of the package by incorporating a molding compound that envelops the components effectively.

Another recent patent is the "Dual RDL stacked die package using vertical wire," which describes a semiconductor package system with a myriad of interconnects that extend vertically from one redistribution layer to another. This innovative configuration, which includes a mold layer and dual-sided redistribution layers, exemplifies a new approach to stacking dies, resulting in increased efficiency and performance.

Career Highlights

Hyoung Il Kim has spent a notable part of his career at major corporations, including Intel Corporation, where he has honed his skills in semiconductor design and development. His extensive experience within the tech industry has allowed him to leverage his inventive capabilities to create practical solutions for complex engineering challenges.

Collaborations

Throughout his career, Kim has collaborated with esteemed colleagues, including Yi Elyn Xu and Juan E Dominguez. These partnerships have enabled him to enhance his inventions by integrating diverse perspectives and expertise from his peers within the semiconductor sector.

Conclusion

Hyoung Il Kim stands out as an influential inventor in the realm of integrated circuit technology. His contributions, marked by multiple patents and innovative designs, have significantly impacted the industry, paving the way for advancements in semiconductor packaging. As he continues to push the boundaries of technology, we can expect future innovations that will redefine the landscape of electronic devices.