The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Dec. 20, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Hyoung Il Kim, Folsom, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/86 (2013.01); H01L 21/4825 (2013.01); H01L 21/4839 (2013.01); H01L 23/49524 (2013.01); H01L 23/49527 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49572 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/50 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06551 (2013.01);
Abstract
An apparatus is provided which comprises: a first die having at least one bond pad; a first flexible layer comprising an anisotropic conductive material, wherein the first flexible layer is adjacent to the at least one bond pad such that it makes an electrical contact with the at least one bond pad; and a second flexible layer comprising a conductive metal, wherein the second flexible layer is adjacent to the first flexible layer.