The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Jan. 14, 2019
Intel Corporation, Santa Clara, CA (US);
Hyoung Il Kim, Folsom, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include a semiconductor package, a package on package system, and a method of forming the semiconductor package. The semiconductor package includes a first redistribution layer, a stack of dies on the first redistribution layer, a second redistribution layer over the stack of dies and the first redistribution layer, and a plurality of interconnects coupled to the stack of dies and the first and second redistribution layers. The interconnects may extend substantially vertical from a top surface of the first redistribution layer to a bottom surface of the second redistribution layer. The semiconductor package may also include a mold layer between the first redistribution layer and the second redistribution layer. The plurality of interconnects may be through mold vertical wire interconnects. The first and second redistribution layers may be dual-sided redistribution layers. The semiconductor package may further include adhesive layers coupled to the stack of dies.