The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Apr. 23, 2019
Intel Corporation, Santa Clara, CA (US);
Florence Pon, Folsom, CA (US);
Yi Xu, Folsom, CA (US);
James Zhang, Folsom, CA (US);
Yuhong Cai, Folsom, CA (US);
Tyler Leuten, Orangevale, CA (US);
William Glennan, Folsom, CA (US);
Hyoung Il Kim, Folsom, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments described herein provide a semiconductor package comprising multiple dies encapsulated in multiple molding compounds. In one example, a semiconductor package comprises: a first die or die stack on a substrate; a first molding compound encapsulating the first die or die stack on the substrate; a second die or die stack on the first molding compound; and a second molding compound encapsulating the second die or die stack and at least one portion of the first molding compound. In this example, the first die or die stack is electrically coupled to the substrate using a first wire bond and the second die or die stack is electrically coupled to the substrate using a second wire bond. Additionally, the first molding compound encapsulates the first wire bond and the second molding compound encapsulates the second wire bond. Furthermore, a footprint of the second die overlaps a footprint of the first die.