Folsom, CA, United States of America

Yi Xu

This inventor holds 6 USPTO granted patents and 3 published patent applications. Top assignees: Intel Corporation, Sk Hynix Nand Product Solutions Corp.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi Xu. Retrieved from https://idiyas.com/inventor/yi-xu-6rgluhks

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Yi Xu

Introduction

Yi Xu is a prominent inventor based in Folsom, California, known for his significant contributions to the field of electronic packaging and interposer technology. With a total of six patents to his name, he has made notable advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his latest patents is the "Interposer with Step Feature." This invention relates to systems and processes that utilize an interposer with step features to electrically couple stacked dies. The design features a ziggurat shape on one or more sides of the interposer, which is referred to as a ziggurat interposer. This innovative approach includes electrical routing that connects the first face of one of the step features with a die.

Another significant patent is for "Choked Flow Cooling." This invention encompasses electronic packages that utilize choked flow cooling mechanisms. The electronic package includes a package substrate, a die that is both electrically and mechanically coupled to the substrate, and a lid that covers the die. The lid features two openings, with a coolant plate that covers one of them, enhancing the cooling efficiency of the electronic package.

Career Highlights

Yi Xu has worked with leading companies in the technology sector, including SK Hynix NAND Product Solutions Corporation and Intel Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of electronic packaging technologies.

Collaborations

Throughout his career, Yi Xu has collaborated with notable colleagues, including Yuhong Cai and Florence R. Pon. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Yi Xu's contributions to the field of electronic packaging and interposer technology are significant and impactful. His innovative patents and collaborations with industry leaders highlight his role as a key figure in advancing technology. His work continues to influence the design and functionality of electronic devices, showcasing the importance of innovation in this rapidly evolving field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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