The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Mar. 27, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Florence Pon, Folsom, CA (US);
Yi Xu, Folsom, CA (US);
Assignee:
SK Hynix NAND Product Solutions Corp., Rancho Cordova, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01);
Abstract
Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to an interposer with step features used to electrically couple stacked dies. In embodiments, the step features may appear as a ziggurat shape to one or more sides of the interposer, which may be referred to as a ziggurat interposer. The interposer may have electrical routing disposed within to electrically couple the first face of the one of the step features with a die.