Florence R Pon

Title: Innovations of Florence R. Pon in Semiconductor Technology

Introduction

Florence R. Pon, based in Folson, California, is an accomplished inventor with a remarkable portfolio comprised of 25 patents. His contributions to the field of semiconductor technology have notably advanced electronic assembly design and manufacturing processes. Pon's innovative approaches showcase a unique blend of creativity and engineering excellence.

Latest Patents

Among his latest inventions, Florence Pon has developed a "Die stack with cascade and vertical connections," an electronic assembly that utilizes a stack of electronic dies arranged in a shingle format. This design incorporates multiple offset stacked die coupled by cascading connections, allowing for vertical electrical connections from the top of the assembly to the bottom die of each shingle. Another significant patent is the "Die over mold stacked semiconductor package," which features a semiconductor package comprising multiple dies encapsulated in different molding compounds. This configuration enables enhanced electrical coupling through wire bonds while optimizing space usage in semiconductor packaging.

Career Highlights

Florence R. Pon has had a distinguished career with significant roles at leading tech companies, including Intel Corporation and SK Hynix NAND Product Solutions Corporation. His work at these organizations has provided a backdrop for the development of his innovative patents, contributing substantially to advancements in semiconductor technologies.

Collaborations

Throughout his career, Pon has collaborated with notable colleagues such as Min-Tih Ted Lai and Tyler Leuten. These partnerships have fostered a collaborative environment that has propelled innovative ideas and solutions in the field of electronics.

Conclusion

Florence R. Pon’s work exemplifies the spirit of innovation in the semiconductor industry. With 25 patents to his name and a career marked by collaboration and technological advancement, he continues to be a significant figure in the realm of electronic assembly and semiconductor packaging. His inventions not only demonstrate inventive prowess but also promise to shape the future of electronic devices through improved functionality and design.