The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Dec. 31, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/50 (2013.01); H01L 23/528 (2013.01); H01L 24/49 (2013.01); H01L 25/0657 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49429 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/38 (2013.01);
Abstract
Electronic device package technology is disclosed. In one example, an electronic device comprises a die () having a bond pad (); and a decoupling capacitor () mounted on the die () and electrically coupled to the die (). A method for making an electronic device comprises mounting a decoupling capacitor () on a die (); and electrically coupling the decoupling capacitor () to the die ().