Company Filing History:
Years Active: 2023
Title: John K Yap: Innovator in Electronic Device Package Technology
Introduction
John K Yap is a notable inventor based in Folsom, CA, who has made significant contributions to the field of electronic device package technology. With a focus on enhancing the functionality and efficiency of electronic devices, Yap has developed innovative solutions that are crucial for modern technology.
Latest Patents
Yap holds a patent for a decoupling capacitor mounted on an integrated circuit die, along with a method of manufacturing the same. This invention is essential for improving the performance of electronic devices. The technology disclosed involves an electronic device that comprises a die with a bond pad and a decoupling capacitor mounted on the die, which is electrically coupled to it. The method for creating this electronic device includes the steps of mounting the decoupling capacitor on the die and ensuring its electrical connection.
Career Highlights
John K Yap is currently employed at Intel Corporation, a leading company in the semiconductor industry. His work at Intel has allowed him to collaborate with some of the brightest minds in technology, contributing to advancements in electronic device packaging.
Collaborations
Some of Yap's notable coworkers include Florence R Pon and Tyler Leuten, who have also made significant contributions to the field. Their collaborative efforts have further enhanced the innovative environment at Intel Corporation.
Conclusion
John K Yap's contributions to electronic device package technology exemplify the impact of innovation in the tech industry. His patent and work at Intel Corporation highlight his role as a key inventor in this evolving field.