Intel Corporation

Sk Hynix Nand Product Solutions Corp.

Florence R Pon

Tyler Leuten

Min-Tih Ted Lai

Yi Elyn Xu

Yuhong Cai

Hyoung Il Kim

John G Meyers

Yi Xu

Nageen Himayat

Divya Vijayaraghavan

Bilal Khalaf

Saeed S Shojaie

Fatema Adenwala

Ankitha Chandran

Maria Angela Damille Ramiso

Mark Forsnes

Xue Yang

Bin Liu

Maruti Gupta Hyde

Yong She

Wei Yee Koay

William Glennan

Naissa Conde

Leo J Craft

Cory A Runyan

John K Yap

James Zhang

Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to an interposer with step features used to electrically couple stacked dies. In embodiments, the step features may appear as a ziggurat shape to one or more sides of the interposer, which may be referred to as a ziggurat interposer. The interposer may have electrical routing disposed within to electrically couple the first face of the one of the step features with a die.

Interposer with step feature

Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.

Computer-assisted or autonomous driving vehicles social network

Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first opening. In an embodiment, the electronic package may further comprise a coolant plate covering the first opening. In an embodiment, the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface. In an embodiment, the first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.

Choked flow cooling

An electronic assembly includes a plurality of electronic die arranged into shingles, each shingle having a multiple offset stacked die coupled by cascading connections. Each shingle is arranged in a stack of shingles with alternate shingles having die stacked in opposite directions and offset in a zigzag manner to facilitate vertical electrical connections from a top of the electronic assembly to a bottom die of each shingle.

Die stack with cascade and vertical connections

Embodiments described herein provide a semiconductor package comprising multiple dies encapsulated in multiple molding compounds. In one example, a semiconductor package comprises: a first die or die stack on a substrate; a first molding compound encapsulating the first die or die stack on the substrate; a second die or die stack on the first molding compound; and a second molding compound encapsulating the second die or die stack and at least one portion of the first molding compound. In this example, the first die or die stack is electrically coupled to the substrate using a first wire bond and the second die or die stack is electrically coupled to the substrate using a second wire bond. Additionally, the first molding compound encapsulates the first wire bond and the second molding compound encapsulates the second wire bond. Furthermore, a footprint of the second die overlaps a footprint of the first die.

Die over mold stacked semiconductor package

A packaged device () includes a substrate () and one or more contacts () disposed on a side of the substrate (). Structures of the packaged device () define at least in part a recess region () that extends from the side of the substrate () and through the substrate (), where one or more contacts () of a second hardware interface are disposed in the recess region (). The one or more contacts () of the first hardware interface enable connection of the packaged device () to a printed circuit board. The one or more contacts () of the second hardware interface enable connection between one or more IC dies of the packaged device () and another IC die () that is a component of the packaged device () or of a different packaged device.

Packaged integrated circuit device with recess structure

A vertical-wire package-in-package includes at least two memory-die stacks that form respective memory modules that are stacked vertically on a bond-wire board. Each memory die in the memory-die stack includes a vertical bond wire that emerges from a matrix for connection. The matrix encloses the memory-die stack, the spacer, and a redistribution layer. At least two memory modules are assembled in a vertical-wire package-in-package.

Multi-die, vertical-wire package-in-package apparatus, and methods of making same

Embodiments described herein are directed to a temporary interconnect for use in testing one or more devices (e.g., one or more dies, inductors, capacitors, etc.) formed in semiconductor package. In one scenario, a temporary interconnect acts an electrical bridge that electrically couples a contact pad on a surface of a substrate and the test pad. Coupling the contact pad and the test pad to each other enables the device(s) coupled the contact pad to be tested. Following testing, the temporary interconnect can be removed or severed so that an electrical break is formed in the conductive path between test pad and the contact pad.

Temporary interconnect for use in testing a semiconductor package

A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.

Shrinkable package assembly

Edge devices utilizing personalized machine learning and methods of operating the same are disclosed. An example edge device includes a model accessor to access a first machine learning model from a cloud service provider. A local data interface is to collect local user data. A model trainer is to train the first machine learning model to create a second machine learning model using the local user data. A local permissions data store is to store permissions indicating constraints on the local user data with respect to sharing outside of the edge device. A permissions enforcer is to apply permissions to the local user data to create a sub-set of the local user data to be shared outside of the edge device. A transmitter is to provide the sub-set of the local user data to a public data repository.

Edge devices utilizing personalized machine learning and methods of operating the same

Electronic device package technology is disclosed. In one example, an electronic device comprises a die () having a bond pad (); and a decoupling capacitor () mounted on the die () and electrically coupled to the die (). A method for making an electronic device comprises mounting a decoupling capacitor () on a die (); and electrically coupling the decoupling capacitor () to the die ().

Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a substrate, a plurality of electronic components in a stacked relationship, and an encapsulant material encapsulating the electronic components. Each of the electronic components can be electrically coupled to the substrate via a wire bond connection and spaced apart from an adjacent electronic component to provide clearance for the wire bond connection. The encapsulant can be disposed between center portions of adjacent electronic components. Associated systems and methods are also disclosed.

Electronic device package

Embodiments described herein provide techniques for testing a semiconductor package by using a diode to couple a test pad to a contact pad. In one scenario, a package comprises a die stack comprising one or more dies and a molding compound encapsulating the die stack. In this package, a substrate is over the molding compound. Also, a test pad and a contact pad are on a surface of the substrate. The contact pad is coupled to the die stack. A diode couples the test pad to the contact pad. In one example, the test pad is coupled to a P side of the diode's P-N junction and the contact pad is coupled to an N side of the diode's P-N junction. In operation, current can flow from the test pad through the contact pad (and the die stack), but current cannot flow from the contact pad through the test pad.

Growing community of inventors

Folson, CA, United States of America

Florence R Pon