Folsom, CA, United States of America

William Glennan


 

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2015-2024

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7 patents (USPTO):Explore Patents

Title: The Innovations of Inventor William Glennan

Introduction: William Glennan, an accomplished inventor based in Folsom, California, has made significant contributions to the field of semiconductor technology. With a total of seven patents to his name, his work continues to shape advancements within the industry.

Latest Patents: Among his most recent inventions are two notable patents that showcase his innovative thinking. The first is a "Die over mold stacked semiconductor package." This invention describes a semiconductor package consisting of multiple dies encapsulated in various molding compounds. The design includes a first die or die stack mounted on a substrate, encapsulated by a molding compound, and a second die or die stack that overlaps the first, all while integrating wire bonds for electrical connectivity. This innovative design is crucial for enhancing the performance and compactness of semiconductor packages.

The second significant patent is related to "SSD restart based on off-time tracker." This patent details a semiconductor apparatus that includes technology for detecting power interruption events and tracking off-time for persistent storage media. This innovation serves to improve system reliability and performance after unexpected power loss, demonstrating a commitment to pushing the boundaries of technology in data storage.

Career Highlights: William Glennan's career with Intel Corporation has been marked by his dedication to advancing semiconductor technology. Through his innovative patents, he has helped to enhance various aspects of semiconductor design and functionality, underscoring his role as a leading inventor in his field.

Collaborations: Glennan collaborates with accomplished colleagues, including Reed D Vilhauer and Naoki Matsumura, contributing to the innovative environment at Intel Corporation. These collaborations foster the development of new ideas and advancements in semiconductor technology, exemplifying the power of teamwork in engineering.

Conclusion: As a prolific inventor, William Glennan continues to make waves in the world of semiconductor technology. His seven patents, particularly his latest innovations, represent a forward-thinking approach that addresses critical challenges in the industry. Through his work at Intel Corporation and collaboration with other talented inventors, Glennan is a prominent figure in fostering innovations that shape the future of technology.

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