James Zhang

Title: The Innovative Contributions of James Zhang

Introduction

James Zhang is a notable inventor based in Folsom, CA. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the efficiency and functionality of semiconductor packages.

Latest Patents

James Zhang holds a patent for a "Die over mold stacked semiconductor package." This invention provides a semiconductor package comprising multiple dies encapsulated in multiple molding compounds. In this design, a first die or die stack is placed on a substrate and encapsulated by a first molding compound. A second die or die stack is then positioned on the first molding compound and encapsulated by a second molding compound. This configuration allows for efficient electrical coupling through wire bonds, while also optimizing the footprint of the semiconductor package.

Career Highlights

James Zhang is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor innovation. His work at Intel has positioned him as a key player in the development of advanced semiconductor technologies. He has been instrumental in projects that aim to improve the performance and reliability of semiconductor devices.

Collaborations

James has collaborated with talented coworkers such as Florence R Pon and Yi Xu. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

James Zhang's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to advancing the field. Through collaboration and creativity, he continues to make a lasting impact in the industry.