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For the Inventor, By the Inventor

Seoul, South Korea

JoungIn Yang

USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 36(Granted Patents)


Location History:

  • Koyang-si, KR (2011 - 2013)
  • Kyoungkido, KR (2010 - 2016)
  • Seoul, KR (2014 - 2016)

Company Filing History:

goldMedal11 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2016

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11 patents (USPTO):Explore Patents
1. 9406579 - Semiconductor device and method of controlling warpage in semiconductor package (2016-08-02),
2. 9401289 - Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces (2016-07-26),
3. 9390945 - Semiconductor device and method of depositing underfill material with uniform flow rate (2016-07-12),
4. 9281228 - Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die (2016-03-08),
5. 9245772 - Stackable package by using internal stacking modules (2016-01-26),
6. 9142481 - Integrated circuit packaging system with heatsink cap and method of manufacture thereof (2015-09-22),
7. 8710640 - Integrated circuit packaging system with heat slug and method of manufacture thereof (2014-04-29),
8. 8598034 - Package-on-package system with through vias and method of manufacture thereof (2013-12-03),
9. 8476775 - Integrated circuit packaging system with embedded interconnect and method of manufacture thereof (2013-07-02),
10. 7986048 - Package-on-package system with through vias and method of manufacture thereof (2011-07-26),
11. 7800211 - Stackable package by using internal stacking modules (2010-09-21),

Title: JoungIn Yang: Innovator in Semiconductor Technology

Introduction

JoungIn Yang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on improving semiconductor devices and their manufacturing processes.

Latest Patents

Among his latest patents, one notable invention is a semiconductor device and method of controlling warpage in semiconductor packages. This invention involves a substrate with an insulating layer, where a semiconductor die is mounted. A channel is formed in the insulating layer around the die, and an underfill material is deposited to enhance stability. Another significant patent is for a semiconductor device and method of backgrinding and singulation of semiconductor wafers. This method aims to reduce kerf shifting while protecting wafer surfaces, utilizing a trench and protective coating to ensure precision during the manufacturing process.

Career Highlights

JoungIn Yang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His expertise has led to advancements that benefit the industry and improve the efficiency of semiconductor devices.

Collaborations

He has collaborated with notable colleagues, including DaeSik Choi and Sang Mi Park, contributing to various projects that enhance semiconductor manufacturing techniques.

Conclusion

JoungIn Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor devices and manufacturing processes.

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