The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 14, 2011
Daesik Choi, Seoul, KR;
Joungin Yang, Seoul, KR;
Minjung Kim, Kwang-ju, KR;
Kyungeun Kim, Ichon-si, KR;
DaeSik Choi, Seoul, KR;
JoungIn Yang, Seoul, KR;
MinJung Kim, Kwang-ju, KR;
KyungEun Kim, Ichon-si, KR;
Stats ChipPac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.