The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Jun. 29, 2007
Joungin Yang, Kyoungkido, KR;
Choongbin Yim, Kyoungki-do, KR;
Keonteak Kang, Namyangju, KR;
Youngchul Kim, Kyonggi-do, KR;
JoungIn Yang, Kyoungkido, KR;
ChoongBin Yim, Kyoungki-do, KR;
KeonTeak Kang, Namyangju, KR;
YoungChul Kim, Kyonggi-do, KR;
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
A semiconductor package has a substrate with solder balls. A first semiconductor die is disposed on the substrate. A first double side mold (DSM) internal stackable module (ISM) is in physical contact with the first semiconductor die through a first adhesive, such as a film on wire adhesive. A second DSM ISM is in physical contact with the first DSM ISM through a second adhesive. The arrangement of the first and second DSM ISM reduce headroom requirements for the package and increase device packing density. Each DSM ISM has semiconductor die disposed in cavities. An interposer is disposed above the top DSM ISM. Wire bonds connect the semiconductor die and DSM ISMs to the solder balls. An encapsulant surrounds the first semiconductor die and first DSM ISM with an exposed mold area in the encapsulant above the interposer.