KeonTeak Kang

Title: KeonTeak Kang: Innovator in Semiconductor Packaging

Introduction

KeonTeak Kang is a notable inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is titled "Stackable package by using internal stacking modules." This invention describes a semiconductor package that comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, with a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.

Another patent under his name is also titled "Stackable package by using internal stacking modules." This invention details a semiconductor package that has a substrate with solder balls. A first semiconductor die is disposed on the substrate, and a first double side mold (DSM) internal stackable module (ISM) is in physical contact with the first semiconductor die through a first adhesive, such as a film on wire adhesive. A second DSM ISM is in physical contact with the first DSM ISM through a second adhesive. The arrangement of the first and second DSM ISM reduces headroom requirements for the package and increases device packing density. Each DSM ISM has semiconductor die disposed in cavities, and an interposer is disposed above the top DSM ISM. Wire bonds connect the semiconductor die and DSM ISMs to the solder balls, while an encapsulant surrounds the first semiconductor die and first DSM ISM with an exposed mold area in the encapsulant above the interposer.

Career Highlights

KeonTeak Kang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance device performance and efficiency.

Collaborations

Throughout his career, KeonTeak has collaborated with talented individuals such as JoungIn Yang and ChoongBin Yim. These collaborations have contributed to the development of cutting-edge technologies in semiconductor packaging.

Conclusion