The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Jun. 05, 2012
Gwangjin Kim, Icheon-si, KR;
Joungin Yang, Seoul, KR;
Dokok Yu, Seoul, KR;
Hoon Jung, Icheon-si, KR;
Jae Han Chung, Ichon-si, KR;
Gwangjin Kim, Icheon-si, KR;
JoungIn Yang, Seoul, KR;
DokOk Yu, Seoul, KR;
Hoon Jung, Icheon-si, KR;
Jae Han Chung, Ichon-si, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.