John O Jacobson

This inventor holds 61 USPTO granted patents, primarily in Semiconductor Manufacturing (CPC class 3247). Top assignee: Micron Technology Incorporated. Active years: 1997-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John O Jacobson. Retrieved from https://idiyas.com/inventor/john-o-jacobson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 61

% Patents Active = 85.2

Average Co-Inventor Count = 3.7

ph-index = 19

Forward Citations = 1,298(Granted Patents)

Forward Citations (Not Self Cited) = 1,263(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

61 out of 39,294

Micron Technology Incorporated

patents

Years Active: 1997-2009

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Areas of Expertise:

Semiconductor Devices

Flip-Chip Technology

Calibration Targets

Interconnect Testing

Burn-In Carrier

Ultrasonic Energy

Electronic Dice

Component Packages

Thermal Management

Data Utilization

Manufacturing Procedures

61 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7589010 - Semiconductor devices with permanent polymer stencil and method for manufacturing the same (2009-09-15),

2. 7561938 - Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs (2009-07-14),

3. 7155300 - Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs (2006-12-26),

4. 7120513 - Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs (2006-10-10),

5. 7105380 - Method of temporarily securing a die to a burn-in carrier (2006-09-12),

6. 7012811 - Method of tuning a multi-path circuit (2006-03-14),

7. 6998334 - Semiconductor devices with permanent polymer stencil and method for manufacturing the same (2006-02-14),

8. 6900459 - Apparatus for automatically positioning electronic dice within component packages (2005-05-31),

9. 6894521 - Burn-in carrier for a semiconductor die (2005-05-17),

10. 6851597 - Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems (2005-02-08),

11. 6713879 - Semiconductor substract with substantially matched lines (2004-03-30),

12. 6703714 - Methods for fabricating flip-chip devices and preventing coupling between signal interconnections (2004-03-09),

13. 6687989 - Method for fabricating interconnect having support members for preventing component flexure (2004-02-10),

14. 6642730 - Test carrier with molded interconnect for testing semiconductor components (2003-11-04),

15. 6627999 - Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps (2003-09-30),

Title: Innovator Spotlight: John O. Jacobson

Introduction

John O. Jacobson is a renowned inventor based in Boise, Idaho, known for his significant contributions to the semiconductor industry. With an impressive total of 61 patents, Jacobson has played a pivotal role in advancing technology through innovation. His work primarily focuses on manufacturing techniques for semiconductor devices, showcasing his expertise and commitment to improving efficiency and functionality in the field.

Latest Patents

Jacobson's recent patents include groundbreaking advancements such as the "Semiconductor devices with permanent polymer stencil and method for manufacturing the same." This patent outlines methods for utilizing permanent or temporary polymer layers with apertures to expose contact pads while covering the active surfaces of semiconductor devices, thereby enhancing manufacturing precision and reliability.

Another notable patent is the "Method for using data regarding manufacturing procedures integrated circuits (ICs) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs." This inventive method revolutionizes the IC manufacturing process by utilizing stored data associated with each IC's fuse ID to determine potential further repairs that may be needed. Jacobson's innovative approach allows for more efficient manufacturing, as unrepairable ICs can be directly sent to a scrap bin, streamlining the overall process.

Career Highlights

John O. Jacobson is currently employed at Micron Technology Incorporated, a leader in the semiconductor sector. Throughout his career, he has made significant contributions to enhancing manufacturing processes and has earned recognition for his innovative thinking and problem-solving capabilities.

Collaborations

Jacobson has collaborated with esteemed colleagues, including Warren M. Farnworth and David R. Hembree. Together, they have pushed the boundaries of semiconductor technology, sharing insights and expertise to drive advancements in the field.

Conclusion

John O. Jacobson's impressive portfolio of patents highlights his vital role in the semiconductor industry. His latest innovations not only exemplify his technical proficiency but also demonstrate a commitment to improving the efficiency and effectiveness of IC manufacturing processes. Through his work at Micron Technology Incorporated and his collaborations with notable colleagues, Jacobson continues to contribute significantly to the world of technology and innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]