The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2009

Filed:

Oct. 06, 2006
Applicants:

Salman Akram, Boise, ID (US);

Warren M. Farnworth, Nampa, ID (US);

Derek J. Gochnour, Boise, ID (US);

David R. Hembree, Boise, ID (US);

Michael E. Hess, Kuna, ID (US);

John O. Jacobson, Boise, ID (US);

James M. Wark, Boise, ID (US);

Alan G. Wood, Boise, ID (US);

Inventors:

Salman Akram, Boise, ID (US);

Warren M. Farnworth, Nampa, ID (US);

Derek J. Gochnour, Boise, ID (US);

David R. Hembree, Boise, ID (US);

Michael E. Hess, Kuna, ID (US);

John O. Jacobson, Boise, ID (US);

James M. Wark, Boise, ID (US);

Alan G. Wood, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.


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