The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Dec. 05, 2002
Warren M. Farnworth, Nampa, ID (US);
Alan G. Wood, Boise, ID (US);
John O. Jacobson, Boise, ID (US);
David R. Hembree, Boise, ID (US);
James M. Wark, Boise, ID (US);
Jennifer L. Folaron, Plano, TX (US);
Robert J. Folaron, Plano, TX (US);
Jay C. Nelson, Dallas, TX (US);
Lelan D. Warren, Dallas, TX (US);
Warren M. Farnworth, Nampa, ID (US);
Alan G. Wood, Boise, ID (US);
John O. Jacobson, Boise, ID (US);
David R. Hembree, Boise, ID (US);
James M. Wark, Boise, ID (US);
Jennifer L. Folaron, Plano, TX (US);
Robert J. Folaron, Plano, TX (US);
Jay C. Nelson, Dallas, TX (US);
Lelan D. Warren, Dallas, TX (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).