The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2009

Filed:

Aug. 23, 2005
Applicants:

Warren M. Farnworth, Nampa, ID (US);

Alan G. Wood, Boise, ID (US);

James M. Wark, Boise, ID (US);

David R. Hembree, Boise, ID (US);

Syed Sajid Ahmad, Boise, ID (US);

Michael E. Hess, Kuna, ID (US);

John O. Jacobson, Boise, ID (US);

Inventors:

Warren M. Farnworth, Nampa, ID (US);

Alan G. Wood, Boise, ID (US);

James M. Wark, Boise, ID (US);

David R. Hembree, Boise, ID (US);

Syed Sajid Ahmad, Boise, ID (US);

Michael E. Hess, Kuna, ID (US);

John O. Jacobson, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.


Find Patent Forward Citations

Farnworth, Warren. (2009). Semiconductor devices with permanent polymer stencil and method for manufacturing the same (U.S. Patent No. 7589010). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7589010

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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