The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2003
Filed:
Jan. 27, 2003
David R. Hembree, Boise, ID (US);
Salman Akram, Boise, ID (US);
Warren M. Farnworth, Nampa, ID (US);
Alan G. Wood, Boise, ID (US);
Derek Gochnour, Boise, ID (US);
John O. Jacobson, Boise, ID (US);
James M. Wark, Boise, ID (US);
Syed Sajid Ahmad, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor carrier for testing semiconductor components, such as bare dice and chip scale packages, and a method for fabricating the carrier are provided. The carrier includes a molded plastic base, a lead frame, and an interconnect. The interconnect includes contacts for making temporary electrical connections with corresponding contacts (e.g., bond pads, solder balls) on the components. The carrier is fabricated by attaching the interconnect to the lead frame, and then molding the plastic base to the interconnect and lead frame. An alternate embodiment carrier includes a board to which multiple interconnects are molded or laminated. In addition, clip members retain the components on the board in electrical communication with the interconnects.