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For the Inventor, By the Inventor

Portland, OR, United States of America

Jihperng Leu

USPTO Granted Patents = 28

Average Co-Inventor Count = 3.0

ph-index = 11

Forward Citations = 723(Granted Patents)


Company Filing History:

goldMedal28 out of 54,902 
 
Intel Corporation
 patents

Years Active: 2002-2012

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28 patents (USPTO):Explore Patents
1. 8299617 - Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects (2012-10-30),
2. 7727892 - Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects (2010-06-01),
3. 7466025 - Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide (2008-12-16),
4. 7348283 - Mechanically robust dielectric film and stack (2008-03-25),
5. 7339271 - Metal-metal oxide etch stop/barrier for integrated circuit interconnects (2008-03-04),
6. 7320935 - Semiconductor device using an interconnect (2008-01-22),
7. 7294934 - Low-K dielectric structure and method (2007-11-13),
8. 7239019 - Selectively converted inter-layer dielectric (2007-07-03),
9. 7214594 - Method of making semiconductor device using a novel interconnect cladding layer (2007-05-08),
10. 7175970 - Mechanically robust interconnect for low-k dielectric material using post treatment (2007-02-13),
11. 7164206 - Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer (2007-01-16),
12. 7145245 - Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein (2006-12-05),
13. 7018918 - Method of forming a selectively converted inter-layer dielectric using a porogen material (2006-03-28),
14. 6998216 - Mechanically robust interconnect for low-k dielectric material using post treatment (2006-02-14),
15. 6992391 - Dual-damascene interconnects without an etch stop layer by alternating ILDs (2006-01-31),

Title: Innovator Spotlight: Jihperng Leu - Revolutionizing Integrated Circuit Interconnects

Introduction:

In the bustling city of Portland, Oregon, a brilliant mind by the name of Jihperng Leu is making waves in the world of technology and innovation. With an impressive portfolio of 28 patents under his belt, Jihperng Leu is paving the way for cutting-edge advancements in integrated circuit interconnects.

Latest Patents:

Among his latest patents is the groundbreaking "Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects." This innovation involves the deposition of a metal layer on a planarized interconnect layer, resulting in the formation of a metal barrier and metal oxide layer that collectively act as a protective layer. Notably, this protective layer improves electromigration performance and serves as an etch-stop during subsequent processes.

Career Highlights:

Jihperng Leu is a key figure at Intel Corporation, a renowned technology company at the forefront of innovation. Within Intel, he has spearheaded numerous projects aimed at enhancing the performance and reliability of integrated circuits. His contributions have not only garnered recognition within the company but have also made a significant impact on the industry as a whole.

Collaborations:

Collaboration plays a vital role in Jihperng Leu's success. Among his esteemed coworkers are Grant M Kloster and Lee D Rockford, with whom he has collaborated on various projects. Together, they form a formidable team dedicated to pushing the boundaries of technology and driving forward advancements in the field of integrated circuitry.

Conclusion:

In conclusion, Jihperng Leu stands as a shining example of innovation and ingenuity in the realm of integrated circuit interconnects. His groundbreaking patents and contributions at Intel Corporation exemplify his commitment to advancing technology and shaping the future of the industry. With a keen eye for detail and a relentless drive for excellence, Jihperng Leu continues to inspire and lead the way towards a more connected and technologically advanced world.

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