Company Filing History:

63 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 2,029

Winbond Electronics Corporation

patents

Years Active: 2007-2025

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65 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12471326 - Guard ring and circuit device (2025-11-11),

2. 12002706 - Structure and method for enhancing robustness of ESD device (2024-06-04),

3. 11742236 - Structure and method for enhancing robustness of ESD device (2023-08-29),

4. 11450735 - Method of forming guard ring and circuit device (2022-09-20),

5. 11264374 - Method of forming electrostatic discharge (ESD) testing structure (2022-03-01),

6. 10991442 - Memory device with a fuse protection circuit (2021-04-27),

7. 10964651 - Method and apparatus of ESD protection in stacked die semiconductor device (2021-03-30),

8. 10957687 - ESD hard backend structures in nanometer dimension (2021-03-23),

9. 10868112 - Circuit device including guard ring and method of forming guard ring (2020-12-15),

10. 10854501 - Structure and method for enhancing robustness of ESD device (2020-12-01),

11. 10803967 - Memory device with a fuse protection circuit (2020-10-13),

12. 10756082 - Method of forming electrostatic discharge (ESD) testing structure (2020-08-25),

13. 10643726 - Memory device with a fuse protection circuit (2020-05-05),

14. 10629588 - ESD hard backend structures in nanometer dimension (2020-04-21),

15. 10546850 - FinFET-based ESD devices and methods for forming the same (2020-01-28),

Title: Innovations of Jen-Chou Tseng in Electrostatic Discharge Devices

Introduction

Jen-Chou Tseng, an accomplished inventor based in Jhudong, Taiwan, has made substantial contributions to the field of electrostatic discharge (ESD) technology. With a remarkable portfolio of 64 patents to his name, his work demonstrates a commitment to advancing the robustness and efficiency of semiconductor devices.

Latest Patents

Among his most recent innovations is a patent titled "Structure and Method for Enhancing Robustness of ESD Device." This invention provides methods and devices aimed at improving the durability of bipolar ESD devices. Specifically, the design introduces an emitter region and a collector region positioned adjacent to each other, with an isolation structure placed between them. By modifying the ballasting characteristics at the isolation structure through the incorporation of at least one partition structure, the patent ensures enhanced performance and reliability in ESD applications.

Career Highlights

Throughout his career, Jen-Chou Tseng has been associated with notable companies, including Taiwan Semiconductor Manufacturing Company Ltd. and Winbond Electronics Corporation. His expertise and innovative spirit have allowed him to develop critical advancements in semiconductor technology that address contemporary challenges in electronic device robustness.

Collaborations

During his career, Jen-Chou has collaborated with esteemed colleagues such as Wun-Jie Lin and Ming-Hsiang Song. These partnerships have played a significant role in the development of his patented technologies, facilitating the exchange of ideas and expertise within the realm of semiconductor innovations.

Conclusion

Jen-Chou Tseng's prolific output of patents and his focus on enhancing ESD device robustness position him as a key figure in the semiconductor industry. His innovations not only contribute to technological advancements but also set the groundwork for future developments in electronic device reliability and performance.

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