The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Nov. 19, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wan-Yen Lin, Hsinchu, TW;

Wun-Jie Lin, Hsinchu, TW;

Yu-Ti Su, Hsinchu, TW;

Bo-Ting Chen, Hsinchu, TW;

Jen-Chou Tseng, Hsinchu, TW;

Kuo-Ji Chen, Hsinchu, TW;

Sun-Jay Chang, Hsinchu, TW;

Min-Chang Liang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 27/02 (2006.01); H01L 21/76 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 21/761 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 21/26513 (2013.01); H01L 21/76 (2013.01); H01L 21/761 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 27/0207 (2013.01); H01L 27/0251 (2013.01); H01L 27/0886 (2013.01); H01L 29/0646 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A method includes implanting a first guard ring around a periphery of core circuitry. The implanting of the first guard ring includes implanting a first component a first distance from the core circuitry on a first side of the core circuitry, and implanting a second component a second distance from the core circuitry on a second side of the core circuitry, wherein the second distance is greater than the first distance. The method further includes implanting a second guard ring around the periphery of the core circuitry. The implanting of the second guard ring includes implanting a third component a third distance from the core circuitry on the first side of the core circuitry, and implanting a fourth component a fourth distance from the core circuitry on the second side of the core circuitry, wherein the third distance is greater than the fourth distance.


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