The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Aug. 18, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Heng Chang, New Taipei, TW;

Jen-Chou Tseng, Jhudong Township, TW;

Ming-Hsiang Song, Shin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 21/66 (2006.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); H01L 23/62 (2006.01); H01L 23/60 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); G01R 31/002 (2013.01); G01R 31/2856 (2013.01); H01L 22/14 (2013.01); H01L 22/30 (2013.01); H01L 22/34 (2013.01); H01L 23/62 (2013.01); H01L 23/60 (2013.01); H01L 25/50 (2013.01);
Abstract

A method of making an electrostatic discharge (ESD) testing structure includes forming, in a first die, a first measurement device. The method further includes forming, in a second die, a fuse, a first trim pad, and a second trim pad. The method further includes forming, between the first die and the second die, a plurality of electrical bonds, wherein a first bond of the plurality of bonds is electrically connected to the first trim pad and a first side of the fuse, and a second bond of the plurality of bonds is electrically connected to the second trim pad and a second side of the fuse.


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