Company Filing History:

18 out of 131,214

Samsung Electronics Co., Ltd.

patents

2 out of 962

Chartered Semiconductor Manufacturing Ltd (corporation)

patents

1 out of 164,108

International Business Machines Corporation

patents

where one patent can have more than one assignee

Years Active: 2002-2010

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 7737029 - Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby (2010-06-15),

2. 7690557 - System and method for displaying received data using separate device (2010-04-06),

3. 7687381 - Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewall (2010-03-30),

4. 7635645 - Method for forming interconnection line in semiconductor device and interconnection line structure (2009-12-22),

5. 7323407 - Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material (2008-01-29),

6. 7307014 - Method of forming a via contact structure using a dual damascene process (2007-12-11),

7. 7192864 - Method of forming interconnection lines for semiconductor device (2007-03-20),

8. 7183195 - Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler (2007-02-27),

9. 7064059 - Method of forming dual damascene metal interconnection employing sacrificial metal oxide layer (2006-06-20),

10. 7041592 - Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process (2006-05-09),

11. 7022600 - Method of forming dual damascene interconnection using low-k dielectric material (2006-04-04),

12. 6936533 - Method of fabricating semiconductor devices having low dielectric interlayer insulation layer (2005-08-30),

13. 6861347 - Method for forming metal wiring layer of semiconductor device (2005-03-01),

14. 6855629 - Method for forming a dual damascene wiring pattern in a semiconductor device (2005-02-15),

15. 6849536 - Inter-metal dielectric patterns and method of forming the same (2005-02-01),

Title: Innovative Contributions of Jae-hak Kim in Semiconductor Technology

Introduction

Jae-hak Kim, based in Seoul, South Korea, is an accomplished inventor with a remarkable portfolio of 18 patents. His contributions to the field of semiconductor technology have significantly enhanced the efficiency of metal interconnect structures and data display methodologies.

Latest Patents

Kim's latest patents demonstrate his focus on advancing semiconductor fabrication methods. One notable patent outlines a method of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas. This innovation involves creating an electrically insulating layer that houses a metal connection, then forming a barrier layer that is treated with a plasma to eliminate oxygen from the metal surface, thereby enhancing device performance and longevity.

Another recent innovation from Kim is a system and method for displaying received data using a separate device. This invention allows a receiving terminal to transmit a unique code to a separate display device connected to the Internet. The display device then retrieves and shows the data corresponding to this code, offering a streamlined approach for data dissemination and user interaction.

Career Highlights

Jae-hak Kim has had a significant impact during his tenure at renowned companies such as Samsung Electronics and Chartered Semiconductor Manufacturing. These experiences have provided him with substantial insights into the semiconductor industry, where he has advanced innovative processes.

Collaborations

Throughout his career, Kim has collaborated with notable professionals in the field, including Kyoung-woo Lee and Hong-Jae Shin. Working alongside such talented colleagues has likely contributed to the depth and breadth of his inventive work.

Conclusion

Jae-hak Kim's dedication to innovation in semiconductor technology is evident through his impressive patent portfolio and the successful collaborations he has pursued. His work continues to influence advancements in the industry, paving the way for future developments in device performance and data handling.

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