The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Jul. 23, 2003
Applicants:
Kyoung-woo Lee, Seoul, KR;
Soo-geun Lee, Suwon, KR;
Wan-jae Park, Suwon, KR;
Jae-hak Kim, Seoul, KR;
Hong-jae Shin, Seoul, KR;
Inventors:
Kyoung-woo Lee, Seoul, KR;
Soo-geun Lee, Suwon, KR;
Wan-jae Park, Suwon, KR;
Jae-hak Kim, Seoul, KR;
Hong-jae Shin, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating dual damascene interconnections is provided. A dual damascene region is formed in a hybrid dielectric layer having a dielectric constant of 3.3 or less, and a carbon-free inorganic material is used as a via filler. The present invention improves electrical properties of dual damascene interconnections and minimizes defects.