IDiyas

For the Inventor, By the Inventor

Saratoga, CA, United States of America

Inderjit Singh

USPTO Granted Patents = 22 

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 103(Granted Patents)


Company Filing History:

goldMedal12 out of 5,002 
 
Xilinx, Inc.
 patents
silverMedal8 out of 5,406 
 
Nvidia Corporation
 patents
bronzeMedal1 out of 3 
 
Xilnix, Inc.
 patents
4. 1 out of 832,680 
Other
 patents

Years Active: 2007-2021

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 11201095 - Chip package having a cover with window (2021-12-14),
2. 11075117 - Die singulation and stacked device structures (2021-07-27),
3. 10840192 - Stacked silicon package assembly having enhanced stiffener (2020-11-17),
4. 10764996 - Chip package assembly with composite stiffener (2020-09-01),
5. 10438863 - Chip package assembly with surface mounted component protection (2019-10-08),
6. 10043730 - Stacked silicon package assembly having an enhanced lid (2018-08-07),
7. 9865567 - Heterogeneous integration of integrated circuit device and companion device (2018-01-09),
8. 9761533 - Interposer-less stack die interconnect (2017-09-12),
9. 9418909 - Stacked silicon package assembly having enhanced lid adhesion (2016-08-16),
10. 9385106 - Method for providing charge protection to one or more dies during formation of a stacked silicon device (2016-07-05),
11. 9341668 - Integrated circuit package testing (2016-05-17),
12. 8900987 - Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices (2014-12-02),
13. 8536717 - Integrated circuit package and method of assembling an integrated circuit package (2013-09-17),
14. 8198727 - Integrated circuit/substrate interconnect system and method of manufacture (2012-06-12),
15. 8017520 - Method of fabricating a pad over active circuit I.C. with frame support structure (2011-09-13),

Title: Inderjit Singh: Innovator in Chip Packaging and Device Structures

Introduction

Inderjit Singh is a notable inventor based in Saratoga, CA, with an impressive portfolio of 22 patents. His innovations primarily focus on advanced chip packaging techniques and die singulation methods that significantly enhance the performance and reliability of electronic devices. Singh's contributions are vital to the evolution of semiconductor technology, influencing multiple sectors within the industry.

Latest Patents

Among his latest patents, Singh has introduced a groundbreaking chip package design that features a cover with windows. This design offers exceptional resistance to warpage while providing necessary access to the internal volume of the chip package. The innovative structure includes a package substrate, an integrated circuit (IC) die, and a thoughtfully designed cover that maximizes protective qualities.

Additionally, Singh has patented techniques for die singulation and the creation of stacked device structures. This patent outlines methods for effectively singulating dies from a workpiece through both chemical etching and mechanical dicing. These singulated dies can be incorporated into stacked devices, enhancing their functionality and overall efficiency.

Career Highlights

Throughout his career, Inderjit Singh has made significant contributions while working for prominent companies such as Xilinx, Inc., a leader in programmable logic devices, and Nvidia Corporation, renowned for its advancements in graphics processing technology. His expertise in semiconductor innovations has paved the way for advancements in various tech applications.

Collaborations

Singh's collaborations with notable colleagues, including Raghunandan Chaware and Ganesh Hariharan, have fostered a spirit of innovation. Together, they have played a pivotal role in developing groundbreaking technologies that continue to shape the future of electronics.

Conclusion

Inderjit Singh's dedication to innovation within the realm of chip packaging and die integration reflects his substantial impact on the field of electronics. With 22 patents to his name, he continues to push the boundaries of technology, demonstrating the vital role of inventors in shaping the future of industry. His work not only enhances efficiency but also ensures that devices are more robust and reliable, a crucial requirement in today's fast-paced technological landscape.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…