The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Sep. 28, 2015
Xilinx, Inc., San Jose, CA (US);
Gamal Refai-Ahmed, Santa Clara, CA (US);
Tien-Yu Lee, San Jose, CA (US);
Ferdinand F. Fernandez, San Jose, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Ivor G. Barber, Los Gatos, CA (US);
Inderjit Singh, Saratoga, CA (US);
Nael Zohni, San Jose, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.