Company Filing History:
Years Active: 2015-2022
Title: **The Innovator Behind Advanced Chip Packaging: Tien-Yu Lee**
Introduction
Tien-Yu Lee is a prominent inventor based in San Jose, California, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of nine patents, Lee has been instrumental in developing innovative solutions that enhance the performance and reliability of electronic components.
Latest Patents
Among his latest innovations are two groundbreaking patents that focus on chip package assemblies. The first patent, titled "Stacked silicon package assembly having thermal management," introduces a novel chip package assembly method that utilizes a plurality of extra-die heat transfer posts for improved thermal management. This design incorporates a first integrated circuit (IC) die mounted to a substrate, with a cover placed over the die. The inclusion of extra-die conductive posts allows for a more efficient heat transfer path between the cover and substrate, significantly enhancing thermal management.
The second patent, "Chip package assembly with enhanced solder resist crack resistance," details a chip package assembly that boasts robust solder connections. This innovation addresses the common issue of solder resist cracking by implementing strategic arrangements of solder pads that connect to pillars of the IC die. By isolating the solder resist surrounding these connections and providing an offset between the centerlines of the pillars and solder pads, Lee's invention enhances the durability and reliability of the package assembly.
Career Highlights
Currently, Tien-Yu Lee is a key contributor at Xilinx, Inc., a leading technology company specializing in adaptive and intelligent computing. His expertise in semiconductor technologies and his innovative approach to challenges in chip packaging have positioned him as a vital asset to the company.
Collaborations
Throughout his career, Lee has collaborated with talented individuals, including colleagues Jaspreet Singh Gandhi and Suresh Ramalingam. These partnerships exemplify the collaborative spirit of innovation that drives technological advancement in the field.
Conclusion
Tien-Yu Lee's inventive work in chip package assemblies represents a significant leap forward in semiconductor technology. His contributions not only enhance product performance but also set new standards in thermal management and reliability. As the demand for high-performance electronics continues to grow, inventors like Lee play a crucial role in shaping the future of the industry.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.