The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Jun. 08, 2017
Xilinx, Inc., San Jose, CA (US);
Jaspreet Singh Gandhi, San Jose, CA (US);
Henley Liu, San Jose, CA (US);
Tien-Yu Lee, San Jose, CA (US);
Gamal Refai-Ahmed, Santa Clara, CA (US);
Myongseob Kim, Pleasanton, CA (US);
Ferdinand F. Fernandez, San Jose, CA (US);
Ivor G. Barber, Los Gatos, CA (US);
Suresh Ramalingam, Fremont, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.