IDiyas

For the Inventor, By the Inventor

San Jose, CA, United States of America

Henley Liu

USPTO Granted Patents = 22 

 

Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 203(Granted Patents)


Company Filing History:

goldMedal22 out of 5,002 
 
Xilinx, Inc.
 patents

Years Active: 2013-2024

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22 patents (USPTO):
1. 12068257 - Integrated circuit (IC) structure protection scheme (2024-08-20),
2. 11901338 - Interwafer connection structure for coupling wafers in a wafer stack (2024-02-13),
3. 11355412 - Stacked silicon package assembly having thermal management (2022-06-07),
4. 11205639 - Integrated circuit device with stacked dies having mirrored circuitry (2021-12-21),
5. 11114344 - IC die with dummy structures (2021-09-07),
6. 11054461 - Test circuits for testing a die stack (2021-07-06),
7. 10971474 - Package integration for high bandwidth memory (2021-04-06),
8. 10770430 - Package integration for memory devices (2020-09-08),
9. 10720377 - Electronic device apparatus with multiple thermally conductive paths for heat dissipation (2020-07-21),
10. 10692837 - Chip package assembly with modular core dice (2020-06-23),
11. 10629512 - Integrated circuit die with in-chip heat sink (2020-04-21),
12. 10593638 - Methods of interconnect for high density 2.5D and 3D integration (2020-03-17),
13. 10529645 - Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management (2020-01-07),
14. 10527670 - Testing system for lid-less integrated circuit packages (2020-01-07),
15. 10431565 - Wafer edge partial die engineered for stacked die yield (2019-10-01),

Title: Innovations and Patents of Henley Liu: A Luminary in Integrated Circuit Design

Introduction

Henley Liu, based in San Jose, CA, is a distinguished inventor with a remarkable portfolio of 22 patents. His contributions to the field of integrated circuits (IC) showcase innovative solutions that enhance the functionality and security of semiconductor technologies.

Latest Patents

Among his latest patents, Liu has introduced an "Integrated Circuit (IC) Structure Protection Scheme," which focuses on safeguarding an IC structure from imaging or unauthorized access. This invention includes a semiconductor substrate with a circuit on its front side, complemented by an electromagnetic radiation blocking layer positioned on the backside to improve protection. Additionally, Liu holds a patent for an "Interwafer Connection Structure for Coupling Wafers in a Wafer Stack." This invention features a hybrid bond interface that facilitates electrical connections among stacked IC dies, significantly reducing the number of mask sets required in fabrication compared to traditional designs.

Career Highlights

Currently, Henley Liu serves at Xilinx, Inc., a leading company in the field of programmable logic devices. His work has been instrumental in driving innovative advancements in integrated circuits, positioning him as a key player in the semiconductor industry.

Collaborations

Throughout his career, Liu has collaborated with noteworthy colleagues such as Myongseob Kim and Cheang-Whang Chang. Together, they continue to push the boundaries of technological development, leading to groundbreaking inventions and patents in integrated circuit technology.

Conclusion

Henley Liu’s extensive patent portfolio and his role at Xilinx, Inc. illustrate his commitment to innovation in the semiconductor field. His inventions not only address current challenges but also pave the way for future advancements in integrated circuit technology, affirming his status as a prominent inventor in the industry.

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