The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Mar. 28, 2017
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Ivor G. Barber, Los Gatos, CA (US);

Suresh Ramalingam, Fremont, CA (US);

Jaspreet Singh Gandhi, San Jose, CA (US);

Tien-Yu Lee, San Jose, CA (US);

Henley Liu, San Jose, CA (US);

David M. Mahoney, Gilroy, CA (US);

Mohsen H. Mardi, Saratoga, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); G01R 31/2889 (2013.01);
Abstract

Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.


Find Patent Forward Citations

Loading…