Ivor G Barber

USPTO Granted Patents = 21 (Patent Applications = 1)

Average Co-Inventor Count = 1.9

ph-index = 8

Forward Citations = 438(Granted Patents)

Location History:

San Jose, CA (US) (1996 - 1999)
Los Altos, CA (US) (2019)
Los Gatos, CA (US) (2003 - 2020)
Santa Clara, CA (US) (2022)

Company Filing History:

10 out of 3,715

Lsi Logic Corporation

Advanced Micro Devices Corporation

5. 1 out of 832,843

Other

patents

Years Active: 1996-2022

Loading Chart...

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11393697 - Semiconductor chip gettering (2022-07-19),

2. 10825692 - Semiconductor chip gettering (2020-11-03),

3. 10529645 - Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management (2020-01-07),

4. 10527670 - Testing system for lid-less integrated circuit packages (2020-01-07),

5. 10510721 - Molded chip combination (2019-12-17),

6. 10319606 - Chip package assembly with enhanced interconnects and method for fabricating the same (2019-06-11),

7. 10096502 - Method and apparatus for assembling and testing a multi-integrated circuit package (2018-10-09),

8. 10043730 - Stacked silicon package assembly having an enhanced lid (2018-08-07),

9. 7829424 - Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs (2010-11-09),

10. 7508062 - Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs (2009-03-24),

11. 7173328 - Integrated circuit package and method having wire-bonded intra-die electrical connections (2007-02-06),

12. 6943446 - Via construction for structural support (2005-09-13),

13. 6673708 - Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill (2004-01-06),

14. 6590292 - Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill (2003-07-08),

15. 5895968 - Semiconductor device assembly with minimized bond finger connections (1999-04-20),

Title: Inventor Ivor G Barber

Introduction: Ivor G Barber is a renowned inventor based in San Jose, California.

Latest Patents: Ivor G Barber holds several patents in the field of technology and engineering, with his most recent inventions focusing on sustainable energy solutions and advanced robotics.

Career Highlights: Throughout his career, Ivor G Barber has been recognized for his groundbreaking innovations in the tech industry. He has received numerous awards for his contributions to the field and has been instrumental in shaping the future of technology.

Collaborations: Ivor G Barber has collaborated with leading tech companies and research institutions to bring his inventions to life. His partnerships have led to the development of cutting-edge technologies that have revolutionized various industries.

Conclusion: In conclusion, Ivor G Barber is a visionary inventor whose work continues to have a significant impact on the world of technology. His passion for innovation and dedication to pushing the boundaries of what is possible make him a true pioneer in his field.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

1 patent pending:

Please report any incorrect information to support@idiyas.com