The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Jun. 01, 2001
Ivor G. Barber, Los Gatos, CA (US);
Zafer S. Kutlu, Menlo Park, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.