The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Aug. 11, 2017
Applicants:

Milind S. Bhagavat, Los Altos, CA (US);

Lei Fu, Austin, TX (US);

Ivor Barber, Los Altos, CA (US);

Chia-ken Leong, San Jose, CA (US);

Rahul Agarwal, San Jose, CA (US);

Inventors:

Milind S. Bhagavat, Los Altos, CA (US);

Lei Fu, Austin, TX (US);

Ivor Barber, Los Altos, CA (US);

Chia-Ken Leong, San Jose, CA (US);

Rahul Agarwal, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/528 (2013.01); H01L 23/5389 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 2224/18 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract

Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.


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