Chia-Ken Leong

Title: Innovations of Inventor Chia-Ken Leong

Introduction

Chia-Ken Leong is an accomplished inventor based in Santa Clara, California, with a remarkable portfolio of six patents. His innovative work in the semiconductor field has led to advancements that enhance the performance and manufacturing processes of electronic devices.

Latest Patents

Among his latest patents are the "Molded Chip Combination" and the "Chip Package with Channel Stiffener Frame." The Molded Chip Combination patent describes various molded chip combinations and methods for manufacturing them. It includes features such as a first semiconductor chip with a first PHY region, a second semiconductor chip with a second PHY region, an interconnect chip, and a molding that joins these components together. Meanwhile, the Chip Package with Channel Stiffener Frame patent outlines semiconductor chip packages and their manufacturing methods, emphasizing a design that integrates passive devices within a channel defined by a stiffener frame.

Career Highlights

Chia-Ken Leong has made significant contributions while working at notable companies in the semiconductor industry. He has held positions at Advanced Micro Devices Corporation and Globalfoundries Inc., where he honed his skills and furthered his expertise in semiconductor technology.

Collaborations

Throughout his career, Chia-Ken has collaborated with several esteemed professionals in the industry, including Stephen F. Heng and Sanjay Dandia. These collaborations have facilitated the exchange of innovative ideas and played a critical role in the development of his patented inventions.

Conclusion

Chia-Ken Leong's contributions to semiconductor technology through his patents reflect his innovative spirit and commitment to advancing the field. His work continues to influence the development of electronics, showcasing the significance of his inventions in modern technology.