The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Dec. 14, 2022
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Gabriel H. Loh, Bellevue, WA (US);

Todd David Basso, Boxborough, MA (US);

Steven Tu, Austin, TX (US);

Joshua A. Hort, Boxborough, MA (US);

Chia-Ken Leong, Santa Clara, CA (US);

Benjamin Beker, Austin, TX (US);

Anwar P. Kashem, Boxborough, MA (US);

Assignee:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/40 (2026.01); H10P 72/70 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 14/40 (2026.01); H10P 72/74 (2026.01);
Abstract

A substrate includes a location for coupling one or more chiplets to the substrate. The location has dimensions that bound dimensions of chiplets capable of being coupled to the substrate in the location. Additionally, the location includes an interface region having connections for one or more die-to-die interfaces of the one or more chiplets and a power region that includes a power interface having connections for the one or more chiplets.


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