Advanced Micro Devices Corporation

Globalfoundries Inc.

Chia-Ken Leong

Sanjay Dandia

Stephen F Heng

Jun Zhai

Eric Tosaya

Tom Ley

Nikon Banouvong

Rahul Kumar Agarwal

Milind S Bhagavat

Ivor G Barber

Lei Fu

Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.

Molded chip combination

Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.

Chip package with channel stiffener frame

Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.

Semiconductor chip package with stiffener frame and configured lid

Circuit package lid

Growing community of inventors

Santa Clara, CA, United States of America

Chia-Ken Leong