The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2012

Filed:

May. 04, 2009
Applicants:

Stephen F. Heng, Los Gatos, CA (US);

Sanjay Dandia, San Jose, CA (US);

Chia-ken Leong, Santa Clara, CA (US);

Inventors:

Stephen F. Heng, Los Gatos, CA (US);

Sanjay Dandia, San Jose, CA (US);

Chia-Ken Leong, Santa Clara, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2006.01); H01L 21/98 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.


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