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For the Inventor, By the Inventor

San Jose, CA, United States of America

Sanjay Dandia

This inventor holds 23 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Advanced Micro Devices Corporation, Lsi Logic Corporation, Vlsi Technology, Inc.. Active years: 1997-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sanjay Dandia. Retrieved from https://idiyas.com/inventor/sanjay-dandia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 23

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.5

ph-index = 8

Forward Citations = 243(Granted Patents)


Location History:

  • Sunnyvale, CA (US) (2016)
  • San Jose, CA (US) (1997 - 2022)

Company Filing History:

goldMedal16 out of 13,192 
 
Advanced Micro Devices Corporation
 patents
silverMedal5 out of 3,715 
 
Lsi Logic Corporation
 patents
bronzeMedal1 out of 1,083 
 
Vlsi Technology, Inc.
 patents
4. 1 out of 16 
 
Vsli Technology, Inc.
 patents

Years Active: 1997-2025

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Areas of Expertise:
Land Grid Array
Back Side Metallization
High Speed Terminals
Socket Assembly
Circuit Board Socket
Semiconductor Device
Interconnect Layout
Staggered Bond Pads
Vacuum Chuck Tool
Surface-Mount Technology
Wire Bondable Package
Electrical Performance
23 patents (USPTO):Explore Patents
1. 12482738 - Systems and methods for dimensioning a land grid array pad (2025-11-25),
2. 11488922 - Back side metallization (2022-11-01),
3. 10957669 - Back side metallization (2021-03-23),
4. 10636736 - Land pad design for high speed terminals (2020-04-28),
5. 10431562 - Back side metallization (2019-10-01),
6. 10389053 - Circuit board socket with rail frame (2019-08-20),
7. 10242962 - Back side metallization (2019-03-26),
8. 9466900 - Circuit board socket with rail frame (2016-10-11),
9. 8216887 - Semiconductor chip package with stiffener frame and configured lid (2012-07-10),
10. D661667 - Socket assembly (2012-06-12),
11. D658607 - Circuit package lid (2012-05-01),
12. D648688 - Socket housing (2011-11-15),
13. D645426 - Socket assembly (2011-09-20),
14. D641720 - Circuit package lid (2011-07-19),
15. D633880 - Socket housing (2011-03-08),

Title: Sanjay Dandia: Pioneering Inventor from San Jose

Introduction: Sanjay Dandia is a visionary inventor based in San Jose, California, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Sanjay Dandia holds several patents in the areas of artificial intelligence, machine learning, and renewable energy technologies, showcasing his commitment to driving progress through innovation.

Career Highlights: With a career spanning over two decades, Sanjay Dandia has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Sanjay Dandia has collaborated with top engineers, scientists, and researchers to bring his ideas to life, leading to successful partnerships and groundbreaking inventions that have had a lasting impact on the world.

Conclusion: Sanjay Dandia's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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