The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Sep. 23, 2016
Applicants:

Stephen F. Heng, Los Gatos, CA (US);

Mahesh S. Hardikar, San Jose, CA (US);

Sanjay Dandia, San Jose, CA (US);

Inventors:

Stephen F. Heng, Los Gatos, CA (US);

Mahesh S. Hardikar, San Jose, CA (US);

Sanjay Dandia, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01R 12/88 (2011.01); H05K 3/32 (2006.01); H05K 7/10 (2006.01); H01R 12/70 (2011.01); H01R 43/20 (2006.01);
U.S. Cl.
CPC ...
H01R 12/88 (2013.01); H01R 12/7076 (2013.01); H01R 43/205 (2013.01); H05K 3/32 (2013.01); H05K 7/1007 (2013.01);
Abstract

Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.


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