The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Dec. 29, 2020
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Myongseob Kim, Pleasanton, CA (US);

Henley Liu, San Jose, CA (US);

Yun Wu, San Jose, CA (US);

Cheang Whang Chang, Mountain View, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/50 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/50 (2013.01); H01L 23/528 (2013.01);
Abstract

Some examples described herein relate to protecting an integrated circuit (IC) structure from imaging or access. In an example, an IC structure includes a semiconductor substrate, an electromagnetic radiation blocking layer, and a support substrate. The semiconductor substrate has a circuit disposed on a front side of the semiconductor substrate. The electromagnetic radiation blocking layer is disposed on a backside of the semiconductor substrate opposite from the front side of the semiconductor substrate. The support substrate is bonded to the semiconductor substrate. The electromagnetic radiation blocking layer is disposed between the semiconductor substrate and the support substrate.


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