The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Nov. 09, 2018
Applicant:
Xilinx, Inc., San Jose, CA (US);
Inventors:
Gamal Refai-Ahmed, Santa Clara, CA (US);
Ho Hyung Lee, San Jose, CA (US);
Hui-Wen Lin, San Jose, CA (US);
Henley Liu, San Jose, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Assignee:
XILINX, INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/40 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4043 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4068 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17519 (2013.01);
Abstract
Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.