The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Jun. 29, 2018
Xilinx, Inc., San Jose, CA (US);
Hong-Tsz Pan, Cupertino, CA (US);
Jonathan Chang, Mountain View, CA (US);
Nui Chong, San Jose, CA (US);
Henley Liu, San Jose, CA (US);
Gamal Refai-Ahmed, Santa Clara, CA (US);
Suresh Ramalingam, Fremont, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the die to at least one exposed die surface.