The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Feb. 02, 2017
Xilinx, Inc., San Jose, CA (US);
Raghunandan Chaware, Sunnyvale, CA (US);
Ganesh Hariharan, Santa Clara, CA (US);
Inderjit Singh, Saratoga, CA (US);
Amitava Majumdar, San Jose, CA (US);
Glenn O'Rourke, Gilroy, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
An example method of manufacturing a semiconductor assembly includes: forming first integrated circuit (IC) dies and dummy dies; forming an interposer wafer including a top side having first mounting sites for the first IC dies and second mounting sites for second IC dies; attaching the first IC dies to the interposer wafer at the first mounting sites and the dummy dies to the interposer wafer at the second mounting sites; processing a backside and the top side of the interposer wafer; removing the dummy dies from the top side of the interposer wafer to expose the second mounting sites; and attaching the second IC dies to the interposer wafer at the exposed second mounting sites.