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For the Inventor, By the Inventor

Gilroy, CA, United States of America

Glenn O'Rourke

USPTO Granted Patents = 10


Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 63(Granted Patents)


Location History:

  • San Juan Bautista, CA (US) (2012)
  • Gilroy, CA (US) (2014 - 2020)

Company Filing History:

goldMedal9 out of 5,002 
 
Xilinx, Inc.
 patents
silverMedal1 out of 3 
 
Xilnix, Inc.
 patents

Years Active: 2012-2020

where 'Filed Patents' based on already Granted Patents

10 patents (USPTO):
1. 10707138 - High yield package assembly technique (2020-07-07),
2. 10032682 - Multi-die wafer-level test and assembly without comprehensive individual die singulation (2018-07-24),
3. 9865567 - Heterogeneous integration of integrated circuit device and companion device (2018-01-09),
4. 9761533 - Interposer-less stack die interconnect (2017-09-12),
5. 9385106 - Method for providing charge protection to one or more dies during formation of a stacked silicon device (2016-07-05),
6. 9372956 - Increased usable programmable device dice (2016-06-21),
7. 9341668 - Integrated circuit package testing (2016-05-17),
8. 9214433 - Charge damage protection on an interposer for a stacked die assembly (2015-12-15),
9. 8900987 - Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices (2014-12-02),
10. 8212576 - Method and apparatus for self-regulated burn-in of an integrated circuit (2012-07-03),

Title: Glenn O'Rourke: Innovator in Integrated Circuit Packaging

Introduction

Glenn O'Rourke is a prominent inventor based in Gilroy, California, known for his significant contributions to the field of integrated circuit packaging. With a total of 10 patents to his name, O'Rourke has developed innovative techniques that enhance the efficiency and effectiveness of IC chip assembly.

Latest Patents

Among his latest patents is a high yield package assembly technique. This invention describes an apparatus and methods for assembling IC chip packages. The process involves determining a first package assembly yield across a die pool and generating a final assembly sequence based on the analysis of multiple performance criteria. Another notable patent focuses on multi-die wafer-level testing and assembly without the need for comprehensive individual die singulation. This method allows for the creation of multi-die packages directly from a wafer, streamlining the testing and packaging process.

Career Highlights

Throughout his career, Glenn O'Rourke has worked with notable companies such as Xilinx, Inc. and Xilnix, Inc. His experience in these organizations has allowed him to refine his skills and contribute to advancements in the semiconductor industry.

Collaborations

O'Rourke has collaborated with talented individuals in his field, including Raghunandan Chaware and Inderjit Singh. These partnerships have fostered innovation and have led to the development of groundbreaking technologies in integrated circuit packaging.

Conclusion

Glenn O'Rourke's work in integrated circuit packaging has made a lasting impact on the industry. His innovative patents and collaborations highlight his dedication to advancing technology in this critical field.

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