The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Feb. 26, 2018
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Ganesh Hariharan, Milpitas, CA (US);

Raghunandan Chaware, Sunnyvale, CA (US);

Inderjit Singh, Saratoga, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 21/263 (2006.01); H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/3178 (2013.01); H01L 23/3185 (2013.01); H01L 25/50 (2013.01); H01L 21/2633 (2013.01); H01L 21/30655 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/10156 (2013.01);
Abstract

Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device structure. The die can be attached to a substrate along with another die that is attached to the substrate. An encapsulant can be between each die and the substrate and laterally between the dies.


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